QFP

QFP

美 　英

• 网络四方扁平封装(Quad Flat Package)；方形扁平封装；四边平坦封装

例句

Finite element method was used to simulate the residual stress in soldered joints of QFP device with three kinds of lead materials.

采用有限元方法对QFP器件三种引线材料焊点的残余应力进行了数值模拟计算分析。

Optimum simulation and prediction on thermal fatigue life of soldered joints of QFP devices

QFP组件的优化模拟及焊点热疲劳寿命的预测

Effect of temperature cycling stress profile on the thermal fatigue life of solder joints of QFP

温度循环应力剖面对QFP焊点热疲劳寿命的影响

Numerical simulation of effect of thermal cycling on tensile strength and microstructure of QFP soldered joint

热循环对QFP焊点强度及其微观组织影响规律的数值模拟

Shape prediction and reliability analysis of QFP solder joint

QFP焊点形态预测及可靠性分析

QFP BGA Ball Grid Array Package

球栅阵列封装

III. QFP Quad Flat Package

方形扁平封装。

High Frequency IC Package Design Based on QFP Lead Frame

基于QFP技术的高频集成电路封装设计