solderability

solderability

美 [sɒldərə'bɪlətɪ] 　英 [sɒldərə'bɪlətɪ]

• n.可焊性；钎焊性
• 网络焊锡性；可焊性测试；可焊度

英汉解释

n.	1. 可焊性 2. 钎焊性

例句

Three layers electrodes' protection, have good solderability.

三层电极保护，可焊性好。

Offers good solderability and excellent wettability .

具有良好的可焊性和优异的熔湿性。

Aerospace series - Elements of electrical and optical connection - Test methods - Part 501 : soft solderability.

航空航天系列.电气和光学连接的件.试验方法.第501部分：软钎焊性

Aerospace series - Cables, electrical, aircraft use - Test methods - Part 509 : solderability.

航空航天系列.飞行器用电缆.试验方法.第509部分：可焊性

The solderability of as-plated Pd coatings produced under different process conditions is good.

镀态下，不同条件下制得的钯镀层具有良好的沾锡能力。

The environment of storage can affect the solderability of surface.

存储环境对表面的可焊性有影响。

SOLDERABILITY AND BRAZEABILITY. DEFINITION AND USE OF A SPECIMEN WITH VARIABLE GAP.

可钎焊性.带可变间隙试样的定义和方法

This paper deals with results of solderability testing.

本文论述焊料可焊性试验的结果。

SOLDERABILITY: According to lead free soldering profiles.

可焊性：根据无铅焊接概况。

SOLDERABILITY: Wave solder, no wash.

可焊性：波焊，不洗。

Poor solderability of component or pad.

元件或焊盘可焊性太低

the layer had good solderability.

保证良好的镀层可焊性。

That is why the solderability was measured before and after ageing also.

这就是为什么可焊性要在老化之前和之后分别进行测量。

Basic environmental testing procedures for electric and electronic products--Guidance on solderability testing by the wetting balance method

电工电子产品基本环境试验规程润湿称量法可焊性试验导则

Monolithic Structure for high reliability High self-resonant frequency Excellent solderability and high heat resistance

迭层独石结构、高度可靠性高自谐频率良好的可焊性和耐焊性

Aerospace series - Cables, electrical, aircraft use - Test methods - Solderability

航空航天系列.飞行器用电缆.试验方法.可焊度

Analysis and Countermeasure about Solderability of Aluminum Electrolytic Capacitor

铝电解电容器可焊性分析及对策

High Solderability Tin alloy Electroplating Technology for Aluminum and Its Alloy

铝及铝合金电镀高可焊性锡基合金工艺

Elements of electrical and optical connection - Test methods - Solderability of contacts with self-contained solder and flux

光电连接件.试验方法.有自制焊料和助熔剂的焊接点的可焊性

The Process Study of Corrosion Resistance and Solderability of Aluminum Alloy

铝合金封装外壳耐蚀性和可焊性工艺研究

Elements of electrical and optical connection - Test methods - Soft solderability

光电连接件.试验方法.软钎焊性

Solderability test for components leads, terminations, lugs, terminals and wires

元器件管脚，端点，接线片，端子及联机的可焊性测试

Solderability Evaluation of Printed Boards with Protective Coatings Over Long-term Storage

带保护性涂层印制板长期贮存的可焊性评价

Accelerated Aging for Solderability Evaluations

可焊性的加速老化评估

Standard Practice for Determining Solderability of Thick Film Conductors

厚膜导体的软钎焊性测定

B Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

元件引线、端子、焊片、接线柱及导线可焊性试验

Factors Influencing the Solderability of Electro Less Nickel and Immersion Gold Layer

化学镀镍金层可焊性的影响因素

Excellent solderability and heat resistance for either flow or reflow soldering

良好的可焊性和耐焊性

The Friction Stir Welding Solderability of the High Strength Al Alloy Plate

高强铝合金厚板搅拌摩擦焊可焊性分

Test methods for bare wires--Solderability test of coating--Solder globule method

裸电线试验方法镀层可焊性试验焊球法

Standard test method for solderability of metallic-coated products

金属覆盖层产品钎焊性的标准试验方法

Development of high speed electroplating additives of unleaded pure tin for pin solderability deposits

引脚可焊性镀层无铅纯锡高速电镀添加剂的开发

On Solderability to Tiny Joint of Electronic Products When Melting Lead-free Solder

熔融无铅焊料对电子产品微连接的钎焊性研究

Analysis and Correct the Bad Solderability of the Gold Plating

镀金板可焊性不良成因分析及改善措施

Solderability tests for surface mounted devices

表面组装元器件可焊性试验

The Changes in Solderability Test Methods for Printed Circuit Boards

印制板可焊性测试方法的变化

Testing of Solderability for Soft Soldering; Wetting tests

软钎焊效能检验.湿度检验

Solderability Evaluation of Thick and Thin Fused Coatings

厚、薄热涂层的可焊性评估

Test Method for Solderability of Metallic-Coated Products

金属涂覆产品的软钎焊性试验方法

Printed Wiring Boards, Solderability of

印制电路板的可焊性