underfill

underfill

美 ['ʌndəˌfɪl] 　英 ['ʌndəfɪl]

• n.填充不足；装填不满；未充满
• 网络底部填充；底胶；填胶

英汉解释

n.	1. 填充不足 2. 装填不满 3. 未充满

例句

This makes complete sense, and it is followed by a picture of a modern chip with the bumps and underfill pointed out.

这使得完整意义上说，这是其次的图片现代芯片的颠簸和底层指出。

The results show that the residual moisture within underfill materials enhances the stress level in solder joint.

结果表明：在湿热环境下，底充胶材料内部残留的湿气提高了焊点的应力水平。

Discuss the necessary of flip chip underfill to ther mal fatigue failures. Put forward controlling parameter for flip chip underfill .

从热疲劳故障的角度论述了倒装芯片底部填充的必要性，介绍了倒装芯片底部填充的参数控制。

Does your SMT facility have underfill capabilities? If so, what machines do they use?

贵公司的SMT设施拥有底充胶能力吗？如果有的话，它们采用什么机器？

The influence of underfill and its material models on the reliability of flip chip package under thermal cycling

底充胶及其材料模型对倒装焊热循环可靠性的影响

Thermal conductivity prediction of underfill and its affects on the flip chip temperature field

底充胶导热系数预测及对倒装焊温度场的影响

Influence of Cure-residual Stress on Underfill Epoxy Reliability in Flip-Chip Assembly Under Thermal Cycling

固化残余应力对倒装焊底充胶可靠性的影响

New Underfill Technology Application and Development

最新底部填充技术的应用及发展

Thermal Cycle Failure of SnPb Solder Joint for Flip Chip Package and Effects of Underfill Material

倒装焊SnPb焊点热循环失效和底充胶的影响

Underfill Delamination of Flip Chip on Low-Cost Board

低成本基板倒装焊底充胶分层裂缝扩展研究