solderable

solderable

美 ['sɒldərəbəl] 　英 ['sɒldərəbl]

• adj.可焊的
• 网络可软焊；焊接能力；可焊接

英汉解释

adj.

1. 可焊的

例句

A uniform , compact , bright and excellent solderable coating with good adhesion was obtained by the experimental electroplating.

经小槽电镀，获得外观致密均匀、似镜面光亮、结合力强、具有优良的可焊性镀层。

The bath components and the operating conditions for a new electroplating technology of solderable bright Sn-Bi alloy were studied.

研究了一种可焊性光亮锡铋合金电镀工艺的镀液配方和电镀操作条件；

Electroless nickel under immersion gold (ENIG) provides a solderable coating , but is expensive .

浸金下无电镀镍（ENIG）涂层可以提高可焊性，但此方法比较昂贵。

Develop: The unexposed PISM is developed away, leaving the solderable pads exposed.

显影：未曝光的部分阻焊膜显影时除去，已曝光部分留存。

Specifications for particular types of winding wires - Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer

特种绕组线规范.155级带粘结层的可焊接聚氨酯漆包圆铜线

Electroplating processes of solderable coatings from methanesulfonate bath

甲基磺酸盐镀液体系可焊性合金镀层的工艺

Surfaces of dense ceramic components for electrical engineering; testing of hard-solderable metal coatings

电工细陶瓷件的表面.可硬钎焊金属镀层的试验

Surfaces of dense ceramic components for electrical engineering; testing of soft-solderable metal coatings

电工细陶瓷件的表面.可软钎焊金属镀层的试验

Specifications for particular types of winding wires - Solderable polyurethane enamelled round copper wire, class 155

特种绕组线规范.155级可焊接聚氨酯漆包圆铜线

Specifications for particular types of winding wires - Solderable polyurethane enamelled round copper wire, class 180

绕组线特殊类型规范.可焊接的聚氨酯漆包圆铜线.180级

Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates

测量可焊膜与基片的粘结强度的方法

Specifications for particular types of winding wires - Solderable polyesterimide enamelled round copper wire, class 180

特种绕组线规范.180级可焊接聚酰胺酯漆包圆铜线

Specifications for particular types of winding wires - Part 51: Solderable polyurethane enamelled round copper wire, class 180

特种绕组线规范。第51部分：钎焊聚氨酯漆包圆铜线180级

Review and Prospect of Solderable Tin-Based Binary Alloy Plating

可焊性锡基二元合金镀层研究的现状与展望

Research and Progress of Lead-free Solderable Tin-Based Coating

无铅可焊性锡基镀层的研究与发展

Developing Status of Solderable Sn Alloy Plating

电镀可焊性锡合金工艺的发展现状

Specifications for particular types of winding wires - Part 20: Solderable polyurethane enamelled round copper wire, class 155; Amendment 2

特种绕组线规范。第20部分：可焊接的聚氨基甲酸乙酯漆包圆铜绕组线，155级。修改件2

Review of tin and solderable tin alloy electroplating

电镀锡和可焊性锡合金发展概况

Progress of research on electroless plating of solderable tin alloy

化学镀可焊性锡基合金的研究进展

Talk on Plating Process of Solderable Bright Sn-Ce Alloy

浅谈可焊性光亮锡铈合金电镀工艺