BGA
美 
英
- 网络球栅阵列(Ball Grid Array)；球栅阵列封装；闸球阵列封装
例句
The BGA program can be described as a time-contingent increase in activities from baseline toward predetermined goals.
BGA计划可被描述为按时间将活动时间从基线提高到预定目标。
This can cause deformation of the BGA-balls when some of the material in the ball flowing into the via.
这可能会导致变形的BGA球时的一些材料在球流入通过。
The point is the basic theories studying on BGA soil activation improving seashore Saline soil in the experiment.
本试验重点是对土壤激活剂BGA改良滨海盐土进行最基本的理论研究。
Spur gear (SGA) or compound bevel gear (BGA) attachments can be provided in any position shown in Figure 1.
如果采用正齿轮（SGA）或复合伞齿轮（BGA）附件，则可以在图1中显示的各个位置安装手轮。
This section contains the top- view illustrations and pin assignments for applicable BGA package types .
适用BGA封装类型的项视详图和引脚分配。
Flexible formed BGA Repair Workstation with option preheater , working stand and soldering station.
灵活选配预热台，工作台架和焊台，可组成BGA返修系统。
BGA rework station development & manufacturing .
研发生产BGA返修台。
Please mail me details of BGA rework station, I need BGA rework station with camera, vaccum Pump, Profile save option on computer etc.
请给我发电邮，详细的BGA工序，我需要的BGA返修站摄像头，真空泵，档案保存选项电脑等。
Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.
本文介绍了用于高速光电组件的表面安装型焊球阵列（BGA）封装技术。
Heating is not good, some area's temperature is not enough, or it's too late to remove the BGA.
加热不均匀，局部地区温度不够或卸芯片不及时。
We provide the welding tools, repair tools, fume extraction and BGA repair center.
我们提供的产品主要分焊接工具，返修工具，空气净化系统和BGA专用返修站。
Must have broad experience with PCBA rework including BGA's and small SMT components (0201, etc. ).
拥有丰富的PCBA返工经验，包括BGA和小SMT器件的返工。
Unique a 3 segments' temperature curve program achieves a steady heat rising and good protection of BGA component.
独设三段式温度曲线程序，实践分段升温控制，令BGA得到妥贴的保护。
It is ideal for cleaning thru hole, BGA and SMT designs, and rinsing residues from connectors.
它是清洁孔洞，BGA和SMT设计的理想清洁剂，还可以清洗连接器的残留物。
BGA problem is the appearance after reflow inspection.
BGA的问题是回流焊后的外观检查。
Very few operators in the BGA market have the scale to overhaul their own engines.
在公务、通用飞机市场，只有极少数的运营商拥有发动机大修能力。
Laser cut trumpet type reballing steel plate and BGA stencil helps precise positioning and easy BGA reballing .
激光刻割喇叭型植锡钢片配合BGA定位模板，准确定位及BGA植锡更容易。
With the population of portable device, mechanical drop reliability of Ball Grid Array (BGA) Packaging becomes more and more important.
随着便携式电子产品的普及，球栅阵列（BallGridArrayBGA）封装的跌落可靠性变得越来越重要。
That was ahead of the 816 billion euros ($1. 17 trillion) forecast for Germany by its foreign trade organization, BGA.
这一数据超过了德国自己的对外贸易机构预测的8160亿欧元（1.17万亿美元）出口额。
Small component around BGA will never be removed because the temperature is lower than the melting point.
在此状态下，焊锡尚未熔化，不会影响周边靠得较近的元件。
Based on the idea of machine's load balance, the Balance Genetic Algorithm (BGA) for AMSF is presented.
基于机床负荷平衡的思想，提出了面向先进制造车间的平衡遗传算法，并与传统的遗传调度算法进行了对比。
Melt the solder ball to remove the BGA.
使焊球熔化以取下芯片。
Shape Prediction of BGA Solder Joint and Its Reliability Optimization Design
BGA焊点的形态预测及可靠性优化设计
Mechanical Test on Reliability of Lead-free BGA Assembly and Microstructure Analysis of Soldering Interface
无铅BGA封装可靠性的跌落试验及焊接界面微区分析
Reliability study of BGA mixed solder joint under thermal cycle
BGA混合焊点热循环负载下的可靠性研究
Three dimensional computer aided design for BGA semiconductor packaging machine
BGA植球机三维计算机辅助模块化设计
BGA Enters Mainstream of the Contemporary Assembly Technology
BGA技术成为现代组装技术的主流
Effect of Geometrical Nonlinearity on Warpage Prediction of Matrix Stacked Die BGA During Assembly Process
集成工艺中叠片BGA阵列翘曲的几何非线性预测分析
Vision inspection technique and application of full-automatic BGA mounting machine
BGA全自动植球机视觉检测技术及应用
Optical BGA Packaging Technology for high-speed Optoelectronic modules
用于高速光电组件的光焊球阵列封装技术
A shadow moire technique by changeable light source for BGA coplanarity measurement
BGA引脚共面度的变光源阴影莫尔测量技术
Application of Infrared Heating Technology to BGA Rework Soldering Center
红外加热技术在BGA返修焊接中心的应用
Water-saving Mechanism and Using Ways of Organic Drought-resistance Fertilizer BGA
有机抗旱肥料BGA的节水机制及其施用技术
Causation and Improvement of Lip Effect in BGA Substrate Singulation Process
BGA基板切割过程中唇缘效应的产生及改进措施
BGA packaging top-view illustration and terminal assignments table, if applicable (not illustrated in Figure 1)
BGA封装过程演示和终端分配表格，如果可采用的话（图1为包括）
High-speed and High-precision Vision Detection and Locating Algorithm of BGA
BGA芯片的高速高精度视觉检测与定位算法
Three-dimensional Measuring Technology for BGA Chip Leads
BGA芯片管脚三维尺寸测量技术
Formation Mechanism of BGA Void and Effects on Solder Joint Reliability
BGA空洞形成的机理及对焊点可靠性的影响
Fatigue Life Assessment of Solder Joints of BGA Component in Board Level Drop Test
BGA焊点在板级跌落实验中的疲劳寿命估计
Mechanical Test and Analysis on the Reliability of Lead-Free BGA Packaging
无铅BGA封装可靠性的力学试验与分析
