multichip

multichip

美 ['mʌltɪtʃɪp] 　英 ['mʌltɪtʃɪp]

• adj.多片的
• 网络多芯片；夕片；多晶粒

英汉解释

adj.

1. 多片的

例句

MultiChip Products leverage Analog Devices silicon into a single package, providing a robust, cost effective and space saving solutions.

多芯片产品将ADI公司的半导体技术引入一个单独的封装，从而提供一种鲁棒性、经济有效和节省空间的解决方案。

Multichip module technology( MCM ) is the optimal way of providing circuit system miniaturization.

多芯片组件技术（MCM）促使电路系统小型化过渡的最好形式。

MultiChip Products can offer MCM solutions at a lower cost then designing and building your own discrete solution.

多芯片产品以较低的成本提供MCM解决方案，然后设计和构建用户自己的分立解决方案。

The present invention provides a multichip package, including a plurality of storage chips and control chips.

本发明提供一种多芯片封装。该多芯片封装包括多个存储芯片和控制芯片。

Because the FT232 chips come with a unique serial number, you can identify the correct device within a multichip environment.

由于FT232芯片出厂时有其的唯一的序号，你可以在一个多芯片模块的环境下找出正确的设备。

Optoelectronic Multichip Modules and Its Application in High-speed Computer and Optical Communication Networks

光电多芯片模块及其在高速计算机和光通信网络中的应用

Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

多芯片组件内层有机绝缘材料的鉴定试验

Characteristics simulation of MEMS packaging using multichip modules technology

基于微机械系统的多芯片组件封装和特性模拟

Guidelines for Multichip Module Technology Utilization

多芯片组件技术应用导则

Application of ANSYS-Finite Element Analysis Software to Thermal Analysis of Multichip Module

有限元分析软件ANSYS在多芯片组件热分析中的应用

Study of Routing Algorithm in Multichip Modules

多芯片组件布线算法研究

Packaging Technology for Multichip Module Using New Type Multilayer Substrate

采用新型多层基板的多芯片组件封装技术

Three Dimensional Finite Element Analysis of Heat Dissipation of Multichip Module

多芯片组件散热的三维有限元分析

Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

有机多芯片模块（MCM-L）及其组装件设计分标准

Multilevel Model of Steady Thermal Simulation for Module Having Multichip and Multisubstrate

计算多芯片多基片模块稳态热场的层次模型

Trends of Ceramic Based Multichip Modules (MCM-C)

陶瓷厚膜型多芯片组件的发展趋势（上）