bonder
美 ['bɑndɚ] 
英 ['bɑndɚ]
- n.压焊机；焊接器；〔建〕束石；丁砖
- 网络见证人；接合剂；接合机
词形变化
复数：bonders
英汉解释
英英解释
例句
"Certainly, Narcissa, I shall make the Unbreakable Vow, " he said quietly. "Perhaps your sister will consent to be our Bonder. "
“当然，纳西莎，我可以立一个牢不可破的誓言，”他轻声说，“也许你姐姐同意做我们的见证人。”
Experimental results can be used to model a real ultrasonic bonder and optimize its functions.
这些均有助于键合机换能系统的工艺建模和优化。
Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder.
键合是IC元件生产的重要封装过程或工序，需要在芯片键合机上完成。
Laugh is no bonder, no estrangement, no limits in relate to value, no difference between wealth and poverty.
笑无国界，无信仰隔阂，无价值关的界限，无贫贱之分。
This paper introduces the original structure and principle of the bond head device for high speed die bonder designed by author.
本文介绍作者设计的高速芯片焊接机焊头的独特结构和工作原理，并给出了主要设计参数和计算公式。
Beautiful and rich Xishuangbanna is like a brilliant pearl inlaid in the southwest bonder of China.
美丽、富饶的西双版纳犹如一颗璀璨的明珠镶嵌在中国的西南边疆。
AIM To investigate effects of the bonder on the bond characteristic of porcelain and cast titanium.
目的观察粘结剂对钛瓷结合性能的影响。
The device can replace the manual machine, and provide an additional equipment of varies die bonder.
该装置可取代手动装置，为各种粘片机提供配套设备。
The sheet is then passed through a thermal bonder (290) to thermally bond the reinforcement glass fibers and resin.
然后使片材通过热粘合机（290），以便热粘合增强玻璃纤维和树脂纤维。
Increasing the stability of enzyme bonder effectively, decreasing its reactive setting at the same time, improving detecting sensitivity.
有效地增加了酶结合物的稳定性，同时也降低了反应背景，提高了检测的灵敏度。
This product design for IC assembly die attache process on die bonder machine.
本产品为IC集成电路封装工艺芯片全自动固晶机上而专门设计。
The auto Die Bonder for SOT-23 transistor is a high-speed, high-precision, machinery-electronics integrated equipment.
SOT-23晶体管封装自动键合机是高速、高精度机电一体化精密设备。
Finally, the slave bonder attaches the connecting bonds based on the computed correct bond locations.
最后从属焊接机基于正确的焊接位置附上连接粘合剂。
Under the condition, how to develop the bonder areas is a serious question to be answered.
在这样的背景下，保税区如何进一步健康发展已经成为需要认真思考和回答的问题。
Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.
基于解析模型的方法，研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律。
Industry: Electronics manufacturing equipment; Bonder; Pressure Welder; Other electronics manufacturing equipment;
所属行业：电子产品制造设备；邦定机；压焊机；其他电子产品制造设备；；
Industry: Other industry-specific equipment; Welding Equipment and Materials; Electronics manufacturing equipment; Bonding process; Bonder;
所属行业：其他行业专用设备；焊接设备与材料；电子产品制造设备；邦定加工；邦定机；；
Industry: Electronics manufacturing equipment; Bonder; Wire binders; Dispensing Equipment;
所属行业：电子产品制造设备；邦定机；焊线机；点胶设备；；
Preparation and Application of Epoxy Resin Bonder Made of Optical Thin Slice of Coal Macerals
环氧树脂煤岩光片黏结剂的制备与应用
Industry: Reflow soldering machine; Mounter; Bonder; Electronic Components Molding Machine; Roll welding; Sealing Machine;
所属行业：回流焊接机；贴片机；邦定机；电子元件成型机；滚焊机；打胶机；；
Industry: Mounter; Bonder; Winding machines, stranding machines; Dispensing Equipment; Hot Press; Vibration plate;
所属行业：贴片机；邦定机；绕线机、绞线机；点胶设备；热压机；振动盘；；
Industry: Dispensing Equipment; Bonder; Mounter; Sealing Machine; Soldering Machine; Spot welder;
所属行业：点胶设备；邦定机；贴片机；打胶机；焊锡机；点焊机；；
Relationship Between the Quality of Rural Population and Peasants'Income in Shaan-Gan-Ning Bonder Area
陕甘宁老区农村人口素质与农民经济收入关系分析
A Real Time Multiple Targets Recognition Algorithm In The Full Automatic Die Bonder
全自动共晶粘片机实时多目标识别的实现
Industry: Bonder; Reflow soldering machine; Mounter; Tin melting furnace; Industrial oven;
所属行业：邦定机；回流焊接机；贴片机；熔锡炉；工业烤箱；；
Industry: Pressure Welder; Soldering Machine; Hot Press; Crimping machine; Bonder;
所属行业：压焊机；焊锡机；热压机；压接机；邦定机；；
Industry: Bonder; Mounter; Sealing Machine; Reflow soldering machine;
所属行业：邦定机；贴片机；打胶机；回流焊接机；；
Performance Calculation of Servo Motor and Motion Control Technology About Wafer Stage in High-speed Die Bonder
高速粘片机晶片工作台的电机选型计算与运动控制
Dynamic Characteristics Analysis of the Horn System with the Wire-clamp in Wire Bonder
带线夹变幅杆系统的动态特性分析
Research and Development of the New Generation High Performance Cellulose-based Bonder
新一代纤维素基高性能黏合剂的研究和发展
Interpreter of Multitasking Framework of Automatic Die Bonder
基于上芯机控制平台的多线程解释器
Application of image recognition technology in the fully automatic COG bonder
图像识别技术在全自动COG压接机中的应用
Application of Linear Motor: Picking and Placement Mechanism in High-speed Die Bonder
线性电机在高速粘片机芯片拾放机构中的应用
Fundamental Principles and Methods of Ultrasonic Control in Wire Bonder
键合机中超声波的基本控制原理及方法
A Chip Image Recognition Algorithm in the Full Automatic Aluminum Wire Bonder
全自动超声波铝丝焊机中的芯片识别算法
Design of the Pneumatic and Vacuum System for High Speed Die Bonder
高速芯片焊接机的气动及真空系统设计
A Study On The Movement Control Technology of Die Picking Mechanism of LED die Bonder
LED粘片机芯片拾取机构运动控制技术研究
Multiobjective Image Recognition Algorithm in the Fully Automatic Chip Bonder
全自动芯片键合机中多目标图像识别算法
Bonder enhances bond character of porcelain and titanium
粘结剂对钛瓷结合性能的影响
Synthesis of Novel Thermoplastic Energetic Bonder Intermediate Based on Novel Cellulose
纤维素基新型热塑性含能粘合剂中间体合成
