wafer
美 [ˈweɪfər] 
英 [ˈweɪfə(r)]
- n.薄片；威化饼；圣饼；圣体
- v.用胶纸封
- 网络晶圆；晶片；圆片
词形变化
复数：wafers
英汉双解
1. | 威化饼，薄脆饼（常与冰淇淋同吃）a thin crisp light biscuit/cookie, often eaten with ice cream |
2. | 圣饼；圣体；面饼a very thin round piece of special bread given by the priest during Communion |
3. | ~ (of sth) 薄片a very thin piece of sth |
英汉解释
n. | 1. 薄脆饼;薄饼一样的东西;【无线,物】圆片;薄片;晶片;【医】糯米纸 |
v. | |
英英解释
例句
The invention relates to a radiator fan, which comprises a fan frame, an inner rotor motor, at least an impeller and a circuit wafer.
一种散热风扇，其包含一个扇框、一个内转子马达、至少一个叶轮及一个电路板。
Virgin Test Wafer- A wafer that has not been used in manufacturing or other processes.
原始测试晶圆片-还没有用于生产或其他流程中的晶圆片。
And a Y-type waveguide coupler on silicon-on-insulator(SOI)wafer used for an Intergrated optoelectronic Model was designed.
设计了一种Y型SOI波导耦合器，用于光纤陀螺光收发模块。
The sub-threshold current test, which is often done at the wafer level, is a measure of how quickly the device will turn on and off.
亚阈区电流测试常常在晶圆片级进行。它是表示器件打开和关闭的快慢程度的参数。
A small disk or wafer of wax, lead, or paper bearing such an imprint and affixed to a document to prove authenticity or to secure it.
封缄上有印章的圆形的小蜡片、铅片或纸片，附在文件后用来证明权威或保证文件的安全。
Egyptian priests practiced "transubstantiation" , claiming to be able to transfer the sun god Osiris into a circular wafer.
古埃及祭司也有“圣餐仪式”，他们声称能够把太阳神奥西里斯转化到一个圆形的薄饼里。
I went into a clean room with a fresh silicon wafer, and then I just cranked away at all the big machines for about 100 hours.
我在无菌室操作一片硅晶片，接着我周转于所有这些大型机器中大约100个小时。
The great game of short-term borrowing, used to purchase longer-term and risky assets, on wafer-thin equity, would be ruled out.
凭借微薄的股本借入短期资金用于购买较长期限高风险资产的游戏将不复存在。
Chip: The individual circuit or component of a silicon wafer, the leadless form of an electronic component.
芯片：单回路或元件的硅晶元，无引脚的电子元件。
The method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate.
一种用于形成用于将焊料转移到晶片的焊料模的方法包括将多个焊料腔蚀刻到基板中。
Area Contamination - Any foreign particles or material that are found on the surface of a wafer.
沾污区域-任何在晶圆片表面的外来粒子或物质。
Contamination Particulate - Particles found on the surface of a silicon wafer.
沾污颗粒-晶圆片表面上的颗粒。
The invention is capable of forming an even spread source coat on the surface of the wafer.
本发明能够在晶片表面形成均匀的扩散源涂层。
The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.
研究金刚石砂轮磨削单晶硅片时的表面磨削温度。
Alternatively, coating the wafer with a nanotube-containing solvent by spinning the disk like a phonograph record also had its problems.
而要是使晶圆像留声机唱盘那样旋转，让含有奈米碳管的溶剂附著在晶圆表面，也还是有问题。
The peripheral portion of the wafer-mounting portion may be formed as a detachable graphite member covered with silicon carbide.
又，载置上述晶片的部分的周边部也可以是自由分离的碳化硅包覆石墨材料。
Extremely wet sticky glutinous rice flour, a small group had to hand-pulling the wet surface, extruded into a wafer shape.
湿糯米粉粘性极强，只好用手揪一小团湿面，挤压成圆片形状。
At least once within the past year, Cree executives decided against moving wafer-making outside the U. S.
在过去一年，Cree管理层至少曾有一次反对把芯片的生产转移到美国以外。
Ophthalmic surgical blades (734) are manufactured from either a crystalline or polycrystalline material, preferably in the form of a wafer.
眼科手术刀片（734）是用优选为晶片形式的结晶或多晶材料制造的。
Waviness - Widely spaced imperfections on the surface of a wafer.
波纹-晶圆片表面经常出现的缺陷。
Minimal Conditions or Dimensions - The allowable conditions for determining whether or not a wafer is considered acceptable.
最小条件或方向-确定晶圆片是否合格的允许条件。
However, due to manufacturing variances, the frequency response of the FBAR devices may vary slightly across the wafer.
然而，由于制造偏差，FBAR器件的频率响应在晶圆上可能略微改变。
The differential microphone is formed using silicon fabrication techniques applied only to a single, front face of a silicon wafer.
该差动式传声器是通过将硅制造技术仅应用到硅片的一个单独的前面上而形成的。
Mounting of the LCD driver wafer on the PCB with gold wires used to connect it to other circuits. It is covered with epoxy.
在PCB上LCD维夫饼乾的安装用过去常常把它和其他电路连结起来的金电线。它被盖住由于环氧。
Disclosed are embodiments of a wafer that incorporates fill structures with varying configurations to provide uniform reflectance.
公开了用于器件特定填充以提高退火均匀性的结构和方法。
The empty area includes an area around the wafer and a cut area for dividing the adjacent ICs.
这种未占用的区域包括晶片周边的区域和将邻近的集成电路分开的切口区。
Waves - Curves and contours found on the surface of the wafer that can be seen by the naked eye.
波浪-晶圆片表面通过肉眼能发现的弯曲和曲线。
The final Ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer.
按照顺序从每一块掩膜版上将图形一层一层地转移到硅片的表面，就制得了成品集成电路。
Electrochemical wafer processing tools are often configured with several different types of chambers to support a processing sequence.
处理工具的电化学的维夫饼干经常用几类不同的寝室成形支持一个处理序列。
The results show that it is feasibility to simulate the wear and interaction of a nano-particle of the CMP on the wafer with AFM.
结果表明：采用AFM探针来模拟CMP过程中单个磨粒对芯片表面的磨损与相互作用的试验方案是完全可行的；
The wafer producer noted that the expansions were to keep pace with tier-one customers' expansion requests.
硅片生产商也声称这次扩产也是满足广大客户商对硅片的不断增长的需求。
This one looks rather like a sponge: thousands of parallel channels perforate a thin wafer of silicon.
这个棘齿看起来比较像纱布：数以千计的平行孔道贯穿一片薄薄的矽晶圆。
Deposition of nanotubes onto the wafer using a gas vapor required temperatures so high that the circuitry already in place would be ruined.
如要利用蒸气将奈米碳管建构在晶圆上，则需很高的温度，但这样一来，原来的电路就会毁坏。
The slicing method of the invention is capable of implementing high area utilization efficiency of the photovoltaic wafer.
本发明的切片方法，可以实现更高的光伏晶片的面积利用效率。
The invention relates to a wafer-level lens module and a manufacturing method thereof.
一种晶圆级镜头模组及其制造方法。
Researchers view each hair-thin wafer of brain tissue under a microscope outfitted with a laser for precision dissection.
研究者使用装备有精密测量激光的显微镜来观察每个稀薄的大脑组织晶片。
and a plurality of column holes are formed in the silicon wafer platform for leading the telescopic vacuum columns to penetrate through.
硅片台内设有若干柱孔，供可伸缩真空柱贯穿其中。
The silicon wafer comprises a silicon substrate, an insulating layer, at least one electric element and at least one perforating hole.
该硅晶片包括硅基材、绝缘层、至少一电性元件及至少一穿导孔。
The invention provides a silicon wafer cross-connecting device and a silicon wafer cross-connecting method thereof.
本发明提供了一种硅片交接装置及其硅片交接方法。
A number of companies around the world are developing or have begun offering devices processed and packaged in the wafer format.
世界上许多公司都正在发展或者已经开始提供具有晶园级封装和工艺的半导体器件。
